- Series Type
- Surveying
- Product Features
-
Enables measurement of a wide range of products at a reasonable price.
This product enables 3D measurement of smooth surfaces and measurement of different heights at high speeds. It is suitable for mass production and can accurately measure the height of bumps on wafers. In addition, it is highly shock-resistant and can be used in a wide range of industrial applications, providing a stable and reliable solution.
Technical Principles and Advantages
Using optical triangulation, parameters such as the shape and height of an object can be measured at high speed.
A light source is projected onto the measurement object and the reflected light forms an image in the camera at a specific angle. Subsequently, the position of the object is calculated using mathematical triangulation based on the angle between the emitted and received directions.
| Wider measurement range than third party products. Depending on the camera specifications, a field of view (FOV) of up to 50 mm can be measured. | Measures smaller bump heights than third party products. Depending on the camera specifications, a field of view (FOV) of up to 50 mm can be measured. |
 |  |
Application Cases
Selection Form
| NL-1 | ||||||
| Model Number | - | Classic I | Classic II | Standard I | Standard II | Standard III |
| Line Width | m | 22 | 43 | 12 | 25 | 50 |
| Line Width | Ⅶ | 5.5 | 11 | 5 | 10 | 20 |
| Horizontal Resolution | Ⅶ | 12 ~ 200 | 100 ~ 800 | 15 ~ 200 | 100 ~ 800 | 800 ~ 1600 |
| Precision | % | 0.5 | 1 | 0.5 | 1 | 2 |
| Repeatability | Ⅶ | 1 | 2 | 1 | 2 | 4 |
| Lens | - | TCL 1.0X | TCL 0.5X | TCL 1.0X | TCL 0.5X | TCL 0.25X |
| Scanning Speed | Max. mm/ sec. | 55 | 110 | 25 | 50 | 100 |
| Packing List | - | 3D Line Scan,PC | ||||
